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- In the test the solder ability plating coating.
在测试电镀镀层的焊锡能力。
- What is a good method for solder bar addition for leadfree solder bar
如何才能很好的为无铅焊料棒添加焊料棒
- Remove excess solder with a small brush or wiping cloth while the solder is plastic.
当焊料成型时，用小刷或抹布清除过多的焊料。
- Effect of Solder Powder Character on Inducing Solder Ball in Course of Refluence Soldering
焊锡粉品质对回流焊时焊料球产生的影响
- In this case the solder pot has to be changed or coated and the solder bar has to be replaced.
在这种情况下, 必须更换或涂抹焊料槽, 并更换焊料棒。
- In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
表面贴装, 钢网是锡膏正确重复印刷得要害。
- Slumping problem can be prevented during preheat. Solder short and capillary solder ball can be kept away.
预热阶段, 不会产生塌陷, 可大幅改善桥连, 微细锡珠等问题。
- Solder Wick A band of wire removes molten solder away from a solder joining or a solder bridge or just for desoldering.
吸锡带用以去除焊点, 桥接, 或脱焊电熔融焊料的线带。
- Solder Balling is recognized by numerous tiny solder balls trapped along the peripheral edge of the flux residue after reflow.
产品回焊后在残留的助焊剂周边会有大量小的锡球。
- For removing dross through converting dross back to solder from solder pot or wave soldering machine， and greatly lower down the solder oxidization.
可用于锡炉和波峰焊中锡渣的还原，大幅降低锡的损耗。
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